Contents of MBB Packaging:

• Wafer Cassette
• Tray
• Tape & Reel
• Printed Circuit Board (PCB), IC Carrier
• IC Packaging
• Sensitive Electronic Products
• Polarizer, Panel
• Lenses
• Passive Components (MLCC)
• Consumer Electronics (Motherboard, RAM)

Functional Features

• Static Surface Resistance: 10⁸~10¹¹ Ω
• Water Vapor Transmission Rate: <0.01g/m² ·day
• Gas Transmission Rate: <0.1c.c./m² ·day
• Heat Sealable
• Vacuum Sealed
• Light Shielding (Opaque)
• Customizable Printing (Inner Surface Printing, Graphic and Text Resistant to Shedding)
• Compliant with EU RoHS (Restriction of Hazardous Substances) and REACH SVHC (Substances of Very High Concern)
• Compliant with Japan SONY SS00259 Standard
• Compliant with California Proposition 65
• Discharge Shielding: <20nJ
• Static Decay: <2s
• EMI Shielding Effectiveness: >40dB
• EMI Shielding Rate: >99.99%
• Standard Product Thickness: 110μ, 140μ, or 170μ (Other Specifications and Thicknesses Can Be Custom-ordered)
• Production Cleanliness: Class 10,000 Clean Room

MBB Packaging Material Structure

Anti-static Coating (ESD-A) / Polyester Film (PET) // Aluminum Foil (AL) // Nylon Film (NY or PA) // Low-Density Polyethylene Film (LDPE or LLDPE) / Anti-static Coating (ESD-B)

ODM& Manufacturing process