In 2023, FFPC commenced operations at its third manufacturing plant. The facility is equipped with a newly installed multifunctional extrusion lamination machine and an advanced R-RTO system, reflecting the company's commitment to smart manufacturing, enhanced environmental performance, and continued global expansion.

The third manufacturing plant features a range of advanced production equipment, including a multifunctional co-extrusion lamination machine jointly developed with Sumitomo Heavy Industries of Japan. Designed to reduce energy consumption, minimize industrial waste, and enhance customization capabilities, the machine enables FFPC to meet the diverse requirements of the semiconductor, electronics, and food packaging industries.

The new plant has significantly strengthened the company's production capacity and order fulfillment capabilities, supporting the growing demand for electronic packaging and sustainable packaging solutions. In recent years, FFPC has actively expanded into the semiconductor supply chain, making electronic packaging a primary growth driver while simultaneously expanding its footprint in North America.